MULTICOMP 070-0003 Earth Bonding Point, 10mm Stud, 14mm x 35mm x 25mm, Rack Mount Tiffen 49BPM3 An O-ring under the enamel

An O-ring under the enamel head of the button keeps it completely secure to the camera when it is tightened down

These BIL socket used for installation in equipment chassis and switch panels with a wall thickness up to 2mm

14 Pins product from ON SEMICONDUCTOR/FAIRCHILD with the model number FUSB302B11MPXOther details

Brand EAO Part Number 61-3440

Thanks to their very low self-discharge rate

MULTICOMP 070-0003 Earth Bonding Point, 10mm Stud, 14mm x 35mm x 25mm, Rack Mount Tiffen 49BPM3 An O-ring under the enamelThis is a Earth Bonding Point, 10mm Stud, 14mm x 35mm x 25mm, Rack Mount product from MULTICOMP with the model number 070 0003Product details End To Ground Resistance 1Mohm No. of Studs 1 Lead Length Ground Terminals Stud Product Range Other details Brand MULTICOMP Part Number 070 0003 Quantity Each Technical Data Sheet EN All product and company names are trademarks or registered trademarks of their respective holders. Use of them does not imply any