FISCHER ELEKTRONIK ICK BGA 27 X 27 X 22 Heat Sink, Square, PCB, For Ball Grid Arrays, BGA, 13.5 °C/W, 22 mm, 27 mm, 27 mm Current Sensors It is suitable for EIA

It is suitable for EIA RS-232 applications

The sleeving provides continuous abrasion protection for wires

UPC: 024616080126

SCREW product from MULTICOMP with the model number MC001533Product details

5 mm female TRS (3-conductor)

FISCHER ELEKTRONIK ICK BGA 27 X 27 X 22 Heat Sink, Square, PCB, For Ball Grid Arrays, BGA, 13.5 °C/W, 22 mm, 27 mm, 27 mm Current Sensors It is suitable for EIAThis is a Heat Sink, Square, PCB, For Ball Grid Arrays, BGA, 13. 5 C W, 22 mm, 27 mm, 27 mm product from FISCHER ELEKTRONIK with the model number ICK BGA 27 X 27 X 22Product details Packages Cooled BGA Thermal Resistance 13. 5C W External Height Metric 22mm External Width Metric 27mm External Length Metric 27mm External Diameter Metric Heat Sink Material Aluminium External Height Imperial 0. 87" External Width Imperial 1. 06" External Length Imperial