FISCHER ELEKTRONIK ICK BGA 23X23 Heat Sink, For Ball Grid Array, BGA, PLCC, 23 �C/W, 6 mm, 23 mm, 23 mm Cokin CX495B Wire Size AWG Max 14AWG

Wire Size AWG Max 14AWG Wire Connection Method Clamp Rated Current 18A No

Variable color temperature from 3

This petal-shaped hood features a ridged interior surface to further restrict unwanted light from reaching your lens and creating unwanted flare

UPC: 050234010245

Surface Mount product from COILCRAFT with the model number CU8965-ALDProduct details

FISCHER ELEKTRONIK ICK BGA 23X23 Heat Sink, For Ball Grid Array, BGA, PLCC, 23 �C/W, 6 mm, 23 mm, 23 mm Cokin CX495B Wire Size AWG Max 14AWGThe ICK BGA 23X23 is a 23 x 23 x 6mm Heat Sink made of aluminium with black anodized surface. This ICK series heat sink can be attached to recommended devices by thermal conductive adhesives and foils. This heat sink acts as a socket suitable for universal processors. 1. 8mm Plate thickness Applications Industrial Product details External Diameter Metric Packages Cooled BGA, PLCC Heat Sink Material Aluminium Thermal Resistance 23C W External Length